All categories
Featured selections
Trade Assurance
Buyer Central
Help Center
Get the app
Become a supplier

The flip-chip process of semiconductor bonding of LED chip is used to spray-print No.678 powder die-bonding solder paste

No reviews yet

Key attributes

Industry-specific attributes

Warranty
6 months

Other attributes

Place of Origin
Guangdong, China
Customized support
OEM, ODM, OBM
Brand Name
Standard&P
viscosity
50PaS
Particle size
2-15um
trademark
Solid solder paste
model
Tin Sn Silver Ag Copper Cu and other metals
type
Solid solder paste flip-chip solder paste
melting point
138℃~275℃
kind
Solid crystal high, medium and low temperature
area of application
LED high power lamp COB flip chip digital tube
Cleaning angle
25
place of production
China-Shenzhen

Packaging and delivery

Packaging Details
Plastic bottle + foam box + ice pack + carton + woven bag

Supply Ability

Supply Ability
2000 Kilogram/Kilograms per Day

Lead time

Quantity (kilograms)1 - 200201 - 1000 > 1000
Lead time (days)510To be negotiated

Customization

Customized logo
Min. order: 500
Customized packaging
Min. order: 500
Graphic customization
Min. order: 500

Product descriptions from the supplier

10 - 499 kilograms
$18.00
500 - 999 kilograms
$16.00
>= 1000 kilograms
$14.00

Variations

Total options:

Shipping

Shipping solutions for the selected quantity are currently unavailable

Membership benefits

Quick refunds on orders under US $1,000View more

Protections for this product

Secure payments

Every payment you make on Alibaba.com is secured with strict SSL encryption and PCI DSS data protection protocols

Refund policy

Claim a refund if your order doesn't ship, is missing, or arrives with product issues